45℃ Thermal Management PCM Safety Protection Flagship: The Key To The Stable Operation Of Electronic Devices

45℃ Thermal Management PCM Safety Protection Flagship: The Key To The Stable Operation Of Electronic Devices

Tips--How to choose phase change materials:

• Thermophysical properties factor
• Physical factors
• Dynamic factor
• Chemical factors
• Economic factors

Summary:

Phase change materials (PCMs) are ideal for thermal management solutions. This is because they store and release thermal energy as they melt and freeze (transition from one stage to another). When this material freezes, it releases a significant amount of energy, in the form of fusion latent heat or crystallization energy. Instead, when a substance melts, it absorbs the same amount of energy from its surroundings as it changes from a solid to a liquid.

How it works:

• When the temperature is below 45 ° C, the 45 ° C thermal management phase change material is in a solid state.
• At this time, the molecular structure or crystal structure of the material is relatively stable, the intermolecular interaction force is strong, and the internal energy of the material is low. As the temperature gradually increases, when the phase transition temperature point of 45℃ is reached, the material begins to undergo phase transition.
• In the process of phase transition, the molecular structure or crystal structure of the material will be changed, the interaction between molecules will be weakened, and the material will be transformed from a solid to a liquid state. This process needs to absorb a lot of heat, which effectively reduces the temperature of the surrounding environment, and plays the role of heat absorption and cooling.
• On the contrary, when the temperature drops from a state higher than 45 ° C, the material will gradually return from liquid to solid, and at the same time release the heat absorbed before, playing the role of heat release and heating. This process of heat absorption and release is reversible and can be repeated.

Application of phase change materials - Heat dissipation of electronic devices:
1. Heat dissipation of the chip

• With the continuous improvement of the performance of electronic equipment, the heating power of the chip is getting higher and higher.
• 45℃ thermal management Phase change materials can be attached to the surface of the chip, when the chip temperature rises to 45℃, the phase change material phase change, from solid to liquid, absorb a lot of heat, so as to effectively reduce the temperature of the chip, protect the chip from overheating damage, extend its service life.
• For example, it is widely used in the heat dissipation of high-power CPU, GPU and other chips.

2. Heat dissipation of the circuit board

• The electronic components on the circuit board will generate heat when working, and the long-term high temperature environment will affect the performance and reliability of the circuit board.
• The application of 45℃ thermal management phase change material to the circuit board can absorb heat when the component is heated, maintain the temperature stability of the circuit board, and reduce the circuit failure caused by excessive temperature.