Chip Cooling Protection Pioneer: Electronic Devices Heat 20℃ Thermal Management Phase Change Materials

Chip Cooling Protection Pioneer: Electronic Devices Heat 20℃ Thermal Management Phase Change Materials

Advantages of the product:
1. Efficient allocation of energy
When the product undergoes a phase change, it responds rapidly to temperature, and the material rapidly releases or absorbs heat according to the ambient temperature.
2. High energy storage density
Compared with ordinary sensible heat materials, phase change materials of the same volume or mass can store more energy.
3. Recycle
Phase change materials generally have a long service life and high reliability.
4. Good temperature uniformity
There is no overheating or undercooling, providing a uniform temperature distribution for application scenarios.

Product application field:
-- Application of phase change materials in the field of electronic equipment.

1. Chip heat dissipation and temperature control

• The 20℃ thermal management phase change material is used in the heat dissipation module of CPU chip of high performance computer. When the temperature of the chip rises to about 20 ° C under high load operation, the phase change material begins to absorb heat, absorb and store the heat generated by the chip, prevent the chip temperature from being too high, ensure that the chip can work in a stable temperature environment, and improve the performance and stability of the computer.

2. Thermal protection of electronic components

• For some temperature-sensitive electronic components, such as high-precision sensors, phase change materials are encapsulated around the component.
• When the ambient temperature fluctuates to 20 ° C, the phase change material plays a role in maintaining the stability of the temperature around the element and avoiding the influence of temperature changes on the accuracy of the sensor.

Product development prospects:
-- Take the field of electronic equipment as an example:

1. Miniaturization and high performance requirements

• Electronic equipment continues to develop in the direction of miniaturization and high performance, and the heat dissipation problem inside the equipment is becoming more and more prominent.
• 20℃ Thermal management Phase change materials enable efficient thermal management in a small space, providing a stable operating temperature environment for electronic devices.
• For example, in mobile devices such as smartphones and tablets, the material can be applied between the chip and the cooling module to absorb the heat generated during the operation of the chip and prevent the chip from overheating, thereby improving the performance and stability of the device.

2.5G and data center development

• The popularization of 5G technology and the large-scale construction of data centers have brought huge heat dissipation needs.
• 20℃ thermal management phase change materials can be used in the heat dissipation system of 5G base stations and data centers, which can quickly absorb and dissipate the heat generated by the equipment to ensure the normal operation of the equipment.
• Compared with traditional heat dissipation methods, the material has higher heat dissipation efficiency and lower energy consumption, helping to reduce the operating costs of 5G base stations and data centers.